US 12,241,907 B2
Chip and fluid-merging method
Kazuhiko Imamura, Osaka (JP); Tsutomu Nakamura, Osaka (JP); Nobuhiko Inui, Saitama (JP); and Ryousuke Takahashi, Osaka (JP)
Assigned to SEKISUI CHEMICAL CO., LTD., Osaka (JP)
Appl. No. 17/601,621
Filed by SEKISUI CHEMICAL CO., LTD., Osaka (JP)
PCT Filed Apr. 20, 2020, PCT No. PCT/JP2020/017036
§ 371(c)(1), (2) Date Oct. 5, 2021,
PCT Pub. No. WO2020/218234, PCT Pub. Date Oct. 29, 2020.
Claims priority of application No. 2019-080930 (JP), filed on Apr. 22, 2019.
Prior Publication US 2022/0196693 A1, Jun. 23, 2022
Int. Cl. B01L 3/00 (2006.01); G01N 35/08 (2006.01); G01N 35/00 (2006.01)
CPC G01N 35/08 (2013.01) [B01L 3/502715 (2013.01); B01L 3/502746 (2013.01); B01L 2200/0684 (2013.01); B01L 2300/0816 (2013.01); B01L 2400/08 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A chip for test or analysis provided with a flow path through which a fluid is delivered, the chip comprising:
a first flow path through which a first fluid is delivered;
a second flow path through which a second fluid is delivered;
a merging portion configured to be provided on a downstream end portion side of the first flow path and merge the first fluid and the second fluid;
a first connection flow path configured to connect the first flow path and the second flow path at the merging portion and have a liquid delivery resistance higher than a liquid delivery resistance of the first flow path;
a second branch flow path configured to branch at a downstream end portion of the first flow path;
a degassing flow path configured to be connected to the second flow path on a downstream side of the first connection flow path;
a third flow path configured to be provided on a downstream side of the merging portion;
a second connection flow path configured to connect the first flow path and the third flow path and have a liquid delivery resistance higher than the liquid delivery resistance of the first flow path,
wherein the merging portion is provided with the first connection flow path and the second branch flow path, and
the liquid delivery resistance of the first connection flow path is higher than the liquid delivery resistance of the second connection flow path.