US 12,241,690 B2
Thermal module structure
Sheng-Huang Lin, New Taipei (TW); and Yuan-Yi Lin, New Taipei (TW)
Assigned to ASIA VITAL COMPONENTS CO., LTD., New Taipei (TW)
Filed by ASIA VITAL COMPONENTS CO., LTD., New Taipei (TW)
Filed on Dec. 12, 2022, as Appl. No. 18/064,294.
Prior Publication US 2023/0243598 A1, Aug. 3, 2023
Int. Cl. F28D 15/00 (2006.01); F28D 15/02 (2006.01)
CPC F28D 15/0275 (2013.01) 5 Claims
OG exemplary drawing
 
1. A thermal module structure, comprising:
an aluminum base having at least one heat pipe receiving groove formed on one side thereof;
a heat dissipation unit including at least one radiation fin assembly formed of a plurality of radiation fins fastened to one another; the radiation fin assembly having a first heat pipe receiving section formed on one side thereof; and the heat dissipation unit and the aluminum base being horizontally parallelly arranged;
a copper embedding layer being provided on a surface of the heat pipe receiving groove, wherein the copper embedding layer includes a deepening surface and a connecting surface formed at two opposite sides of the copper embedding layer; the deepening surface gripping and penetrating into surfaces of the heat pipe receiving groove and the first heat pipe receiving section; and the connecting surface being an exposed surface of the copper embedding layer for connecting with a weld layer; and
a plurality of heat pipes made of a copper material and respectively having an end being a heat absorption section fitted in the heat pipe receiving groove and another horizontally extended end being a remote condensation section connected to the first heat pipe receiving section of the heat dissipation unit; and
wherein the aluminum base and the heat dissipation unit can be directly welded to the heat pipes via the copper embedding layer.