US 12,241,668 B2
Heat management system
Tomonori Haraguchi, Isesaki (JP)
Assigned to SANDEN CORPORATION, Isesaki (JP)
Appl. No. 18/043,601
Filed by SANDEN CORPORATION, Isesaki (JP)
PCT Filed Aug. 24, 2021, PCT No. PCT/JP2021/030903
§ 371(c)(1), (2) Date Mar. 1, 2023,
PCT Pub. No. WO2022/064930, PCT Pub. Date Mar. 31, 2022.
Claims priority of application No. 2020-158973 (JP), filed on Sep. 23, 2020.
Prior Publication US 2023/0349606 A1, Nov. 2, 2023
Int. Cl. F25B 41/42 (2021.01); B60H 1/00 (2006.01); B60H 1/32 (2006.01); B60K 1/00 (2006.01); B60K 11/02 (2006.01); F25B 25/00 (2006.01); F25B 29/00 (2006.01)
CPC F25B 41/42 (2021.01) [B60H 1/00885 (2013.01); B60H 1/32284 (2019.05); B60K 11/02 (2013.01); F25B 25/005 (2013.01); F25B 29/003 (2013.01); B60K 1/00 (2013.01); B60K 2001/003 (2013.01); B60K 2001/005 (2013.01); B60K 2001/006 (2013.01); F25B 2339/047 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A heat management system comprising:
a refrigerant circuit through which a refrigerant is circulated;
a high-temperature heat medium circuit through which heat medium pumped from a first pump is heated by heat released from the refrigerant, and circulated;
a low-temperature heat medium circuit through which heat medium pumped from a second pump is cooled by absorbing heat into the refrigerant, and circulated;
a temperature adjustment heat exchanger configured to adjust a temperature of a heat management subject;
a heat medium mixer connected to an upstream side of the temperature adjustment heat exchanger, and configured to mix high-temperature heat medium from the high-temperature heat medium circuit and low-temperature heat medium from the low-temperature heat medium circuit at a ratio depending on a target temperature of the heat management subject; and
a branching point provided at a downstream side of the temperature adjustment heat exchanger, and configured to return the heat medium from the temperature adjustment heat exchanger to the high-temperature heat medium circuit and the low-temperature heat medium circuit wherein:
a first part of the heat medium branched at the branching point is returned to the high-temperature heat medium circuit through a first connector upstream of the first pump;
a second part of the heat medium branched at the branching point is returned to the low-temperature heat medium circuit through a second connector upstream of the second pump; and
a check valve is provided in each of the flow paths between the branching point and the first connector and between the branching point and the second connector.