US 12,241,662 B2
Solid-state refrigeration apparatus
Akio Yoshimoto, Osaka (JP); Junichi Teraki, Osaka (JP); and Michio Moriwaki, Osaka (JP)
Assigned to DAIKIN INDUSTRIES, LTD., Osaka (JP)
Filed by DAIKIN INDUSTRIES, LTD., Osaka (JP)
Filed on Mar. 1, 2022, as Appl. No. 17/684,244.
Application 17/684,244 is a continuation of application No. PCT/JP2020/034168, filed on Sep. 9, 2020.
Claims priority of application No. 2019-175532 (JP), filed on Sep. 26, 2019.
Prior Publication US 2022/0186991 A1, Jun. 16, 2022
Int. Cl. F25B 21/00 (2006.01)
CPC F25B 21/00 (2013.01) [F25B 2321/0023 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A solid-state refrigeration apparatus comprising:
a solid cooling portion including a solid refrigerant substance, an internal channel where the solid refrigerant substance is disposed, and an induction section configured to cause the solid refrigerant substance to produce a caloric effect;
at least one first heat exchanger;
at least one second heat exchanger;
a heating medium circuit connected to the first heat exchanger, the second heat exchanger, and the internal channel;
a reciprocating conveying mechanism configured to reciprocally convey a heating medium in the heating medium circuit; and
a thermal storage section,
the solid-state refrigeration apparatus being configured to perform
a heat application operation in which the heating medium heated by the solid cooling portion dissipates heat in the first heat exchanger and the heating medium cooled by the solid cooling portion absorbs heat in the second heat exchanger, and
a defrosting operation in which frost on the second heat exchanger is melted,
the thermal storage section being configured to store heat in the heat application operation,
in the defrosting operation, the frost on the second heat exchanger being melted using the heat stored in the thermal storage section, and
in the defrosting operation, the heating medium in the thermal storage section flowing through the second heat exchanger and returning to the thermal storage section without passing through the solid cooling portion.