US 12,241,649 B2
MPC for HVAC with thermal model selection
Thomas William Dupuis Stesco, Toronto (CA)
Assigned to GENERAC POWER SYSTEMS, INC., , WI (US)
Filed by GENERAC POWER SYSTEMS, INC., Waukesha, WI (US)
Filed on Feb. 2, 2022, as Appl. No. 17/591,005.
Prior Publication US 2023/0243541 A1, Aug. 3, 2023
Int. Cl. F24F 11/64 (2018.01); F24F 11/38 (2018.01); F24F 11/47 (2018.01); G05B 13/04 (2006.01); G05B 15/02 (2006.01); F24F 140/60 (2018.01)
CPC F24F 11/64 (2018.01) [F24F 11/38 (2018.01); F24F 11/47 (2018.01); G05B 13/04 (2013.01); G05B 15/02 (2013.01); F24F 2140/60 (2018.01)] 18 Claims
OG exemplary drawing
 
1. A device comprising:
memory storing a first thermal model of a building and a second thermal model of the building;
a processor connected to the memory, the processor configured to:
obtain an operational parameter of a heating, cooling, ventilation, and/or air conditioning (HVAC) apparatus at the building;
compare the operational parameter to a threshold;
when the operational parameter exceeds the threshold, select the first thermal model as a selected thermal model;
when the operational parameter does not exceed the threshold, select the second thermal model as the selected thermal model; and
execute model predictive control using the selected thermal model to control the HVAC apparatus at the building;
determine an error between a sensed HVAC condition of the building and a predicted HVAC condition predicted by the selected thermal model; and
when the error exceeds an error tolerance, disable the model predictive control and enable a reactive control algorithm to control the HVAC apparatus.