	US 12,240,919 B2
	Method for supporting thiol group-including compound
Takuma Suzuki, Settsu (JP); Dai Murata, Takasago (JP); Masakatsu Nishihachijyo, Takasago (JP); and Hisako Yaura, Takasago (JP)
Assigned to KANEKA CORPORATION, Osaka (JP)
Appl. No. 17/434,039
Filed by KANEKA CORPORATION, Osaka (JP)
PCT Filed Feb. 27, 2020, PCT No. PCT/JP2020/008017 § 371(c)(1), (2) Date Aug. 26, 2021, PCT Pub. No. WO2020/195514, PCT Pub. Date Oct. 1, 2020.
Claims priority of application No. 2019-057650 (JP), filed on Mar. 26, 2019.
Prior Publication US 2022/0135705 A1, May 5, 2022
Int. Cl. C07K 17/14 (2006.01); C07K 1/22 (2006.01)

CPC C07K 17/14 (2013.01) [C07K 1/22 (2013.01)]

19 Claims

1. A method for supporting a thiol group-including compound on an insoluble base material, the method comprising:

Step A: treating a thiol group-including compound with a thiol group-including organic reducing agent and an inorganic reducing agent in a solvent, and

Step B: contacting the insoluble base material with the solvent after the thiol group-including compound is treated with the thiol group-including organic reducing agent and the inorganic reducing agent in Step A.