US 12,240,751 B2
Sensor package substrate, sensor module having the same, and sensor package substrate manufacturing method
Kazutoshi Tsuyutani, Tokyo (JP); and Yoshihiro Suzuki, Tokyo (JP)
Assigned to TDK Corporation, Tokyo (JP)
Appl. No. 17/620,485
Filed by TDK Corporation, Tokyo (JP)
PCT Filed Jun. 5, 2020, PCT No. PCT/JP2020/022240
§ 371(c)(1), (2) Date Dec. 17, 2021,
PCT Pub. No. WO2020/255745, PCT Pub. Date Dec. 24, 2020.
Claims priority of application No. 2019-113959 (JP), filed on Jun. 19, 2019.
Prior Publication US 2022/0267142 A1, Aug. 25, 2022
Int. Cl. H01L 21/48 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); G01D 11/24 (2006.01); H01L 23/498 (2006.01); H04R 1/04 (2006.01); H04R 19/04 (2006.01)
CPC B81B 7/0061 (2013.01) [B81C 1/00309 (2013.01); G01D 11/245 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/0278 (2013.01); B81B 2207/012 (2013.01); B81C 2203/0109 (2013.01); H04R 1/04 (2013.01); H04R 19/04 (2013.01); H04R 2201/003 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A sensor package substrate comprising:
a sensor chip mounting area for mounting a sensor chip; and
a plurality of through holes formed at a position overlapping the sensor chip mounting area in a plan view so as to penetrate the sensor package substrate from one surface to other surface thereof,
wherein the plurality of through holes include first and second through holes,
wherein the first through hole has a minimum inner diameter at a first depth position,
wherein the second through hole has a minimum inner diameter at a second depth position, and
wherein the first and second depth positions are located at different depth levels, and
wherein diameters of the first and second through holes at the one surface differ from each.