US 12,240,748 B2
MEMS die and MEMS-based sensor
Peter V. Loeppert, Durand, IL (US); Michael Pedersen, Long Grove, IL (US); and Vahid Naderyan, Chicago, IL (US)
Assigned to Knowles Electronics, LLC, Itasca, IL (US)
Filed by Knowles Electronics, LLC, Itasca, IL (US)
Filed on Mar. 21, 2021, as Appl. No. 17/207,722.
Prior Publication US 2022/0298005 A1, Sep. 22, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B81B 3/00 (2006.01)
CPC B81B 3/0021 (2013.01) [B81B 3/0054 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/04 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A micro-electro-mechanical systems (MEMS) die comprising:
an enclosure;
a diaphragm disposed across an opening of the enclosure, the diaphragm comprising a first electrode,
wherein the enclosure and the diaphragm define a back volume and every point within the back volume is less than a thermal boundary layer thickness from a nearest surface; and
a second electrode disposed outside of the back volume and facing the diaphragm.