US 12,240,237 B2
Unsupported top hat layers in printhead dies
Vincent C. Korthuis, Corvallis, OR (US); Huyen Pham, Corvallis, OR (US); and Tsuyoshi Yamashita, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed on Mar. 17, 2023, as Appl. No. 18/123,134.
Application 18/123,134 is a continuation of application No. 17/414,413, granted, now 11,648,773, previously published as PCT/US2019/050025, filed on Sep. 6, 2019.
Prior Publication US 2023/0230790 A1, Jul. 20, 2023
Int. Cl. B41J 2/14 (2006.01); H01H 85/02 (2006.01)
CPC B41J 2/1404 (2013.01) [H01H 85/0241 (2013.01); H01H 2085/0266 (2013.01); H01H 2085/0275 (2013.01); H01H 2085/0291 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printhead die comprising:
a substrate;
a chamber layer on the substrate; and
a top hat layer on the chamber layer, the top hat layer comprising an initial unsupported top hat layer portion comprising a first end that is narrower than a second end.