US 12,240,206 B2
Mitigating defects in an electrochromic device under a bus bar
Ronald M. Parker, Olive Branch, MS (US); Anshu Ajit Pradhan, Collierville, TN (US); Abhishek Anant Dixit, Collierville, TN (US); and Douglas Samuel Dauson, Olive Branch, MS (US)
Assigned to View Operating Corporation, San Jose, CA (US); and Corning Incorporated, Corning, NY (US)
Filed by View, Inc., Milpitas, CA (US); and Corning Incorporated, Corning, NY (US)
Filed on Apr. 13, 2023, as Appl. No. 18/300,123.
Application 18/300,123 is a continuation of application No. 17/248,933, filed on Feb. 12, 2021, granted, now 11,654,659.
Application 17/248,933 is a continuation of application No. 16/310,164, granted, now 11,623,433, issued on Apr. 11, 2023, previously published as PCT/US2017/037552, filed on Jun. 14, 2017.
Claims priority of provisional application 62/351,854, filed on Jun. 17, 2016.
Prior Publication US 2023/0294384 A1, Sep. 21, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 17/10 (2006.01); B29C 65/00 (2006.01); G02F 1/1524 (2019.01); G02F 1/153 (2006.01); G02F 1/155 (2006.01)
CPC B32B 17/10807 (2013.01) [B32B 17/10146 (2013.01); B32B 17/10302 (2013.01); B32B 17/10513 (2013.01); B32B 17/1088 (2013.01); B32B 17/1099 (2013.01); G02F 1/153 (2013.01); G02F 1/1533 (2013.01); G02F 1/155 (2013.01); B29C 66/006 (2013.01); B29C 66/0382 (2013.01); B29C 2793/0027 (2013.01); G02F 1/1524 (2019.01)] 13 Claims
OG exemplary drawing
 
1. A method of manufacturing an electrochromic device comprising an electrochromic stack between a first and a second transparent electronically conductive layer configured to deliver potential over surfaces of the electrochromic stack and thereby cause optical switching of the electrochromic device, the method of manufacturing comprising:
(a) fabricating the electrochromic stack on a glass substrate without pre-patterning in a first facility;
(b) shipping the glass substrate including the electrochromic stack to a second facility; and
(c) performing post-processing in the second facility,
wherein a protective layer is deposited over the second transparent electronically conductive layer and the electrochromic stack in the first facility, wherein the protective layer is a hermetic top coat,
wherein (c) comprises removing the deposited protective layer.