	US 12,240,177 B2
	Printing method for additive manufacturing, including in-situ powder regeneration by removing portions of deposited powder
Morteza Vatani, Los Gatos, CA (US); Seyed Mohammad Sajadi, San Jose, CA (US); Steven Zhichao Shi, Santa Clara, CA (US); David Paul Wanamaker, San Jose, CA (US); Siamak Azizi, Los Gatos, CA (US); and Karl Littau, Los Altos Hills, CA (US)
Assigned to Sakuu Corporation, San Jose, CA (US)
Filed by Sakuu Corporation, San Jose, CA (US)
Filed on Jan. 13, 2023, as Appl. No. 18/154,775.
Claims priority of provisional application 63/299,867, filed on Jan. 14, 2022.
Prior Publication US 2023/0226756 A1, Jul. 20, 2023
Int. Cl. B29C 64/357 (2017.01); B22F 10/14 (2021.01); B22F 10/73 (2021.01); B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01)

CPC B29C 64/357 (2017.08) [B22F 10/14 (2021.01); B22F 10/73 (2021.01); B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12)]

15 Claims

1. A method, comprising:

depositing powder on a substrate at a powder deposition station;

removing first portions of the powder to create clean portions of the substrate between portions of deposited powder;

moving remaining portions of deposited powder remaining on the substrate to a wetting station and wetting the powder with a wetting agent at the wetting station;

passing the wetted portions of deposited powder through a compacting station to compact the powder;

cutting the substrate at the clean portions to create substrate segments each respectively including one of the remaining portions of the deposited powder;

transferring the substrate segments having deposited powder mounted thereon to respective carrier frames;

moving the substrate segments to a binder jetting station and depositing a binder to the powder at the binder jetting station; and

moving the carrier frames, with the substrate segments having the layers mounted thereon, to a stacking station, to stack the layers individually on one another to form a multilayer product.