US 12,240,171 B2
Material dispense device, three-dimensional shaping device, and injection molding device
Masaaki Ogihara, Matsumoto (JP); Kazuhide Nakamura, Asahi (JP); and Taki Hashimoto, Shiojiri (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Jan. 23, 2023, as Appl. No. 18/099,989.
Claims priority of application No. 2022-008587 (JP), filed on Jan. 24, 2022.
Prior Publication US 2023/0234286 A1, Jul. 27, 2023
Int. Cl. B29C 64/209 (2017.01); B29C 45/20 (2006.01); B33Y 30/00 (2015.01); B29C 64/118 (2017.01); B33Y 10/00 (2015.01)
CPC B29C 64/209 (2017.08) [B29C 45/20 (2013.01); B33Y 30/00 (2014.12); B29C 64/118 (2017.08); B33Y 10/00 (2014.12)] 10 Claims
OG exemplary drawing
 
1. A material dispense device comprising:
a nozzle portion configured to dispense a material; and
a main body portion that has a flow path for the material and to which the nozzle portion is attached, wherein
the main body portion includes
a body portion provided with a male screw at an outer periphery thereof and having an outlet of the flow path,
the nozzle portion includes
a nozzle tip that has a dispense opening at a front end of an in-nozzle flow path, and that is pressed against the body portion in an arrangement in which the in-nozzle flow path and the outlet of the flow path communicate with each other, and
a pressing member configured to press the nozzle tip against the body portion in a state in which the dispense opening is exposed to outside, and having a female screw capable of being fastened to the male screw at an inner periphery of the pressing member,
the nozzle tip is pressed against the body portion by fastening the male screw and the female screw,
a thermal conductivity of the nozzle tip is lower than a thermal conductivity of the body portion, and
the nozzle tip is elastically deformable.