US 12,240,076 B2
Conditioner disk, chemical mechanical polishing device, and method
Hsien Hua Shen, Hsinchu (TW); and Hsun-Chung Kuang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 31, 2023, as Appl. No. 18/362,134.
Application 18/362,134 is a continuation of application No. 17/038,465, filed on Sep. 30, 2020, granted, now 11,787,012.
Claims priority of provisional application 62/929,050, filed on Oct. 31, 2019.
Prior Publication US 2024/0025014 A1, Jan. 25, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. B24B 53/017 (2012.01); B24B 53/12 (2006.01)
CPC B24B 53/017 (2013.01) [B24B 53/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A pad conditioner, comprising:
a conditioning disk including:
a substrate plate having an outer rim, a first surface and a second surface that faces away from the first surface; and
at least one channel segment in the second surface of the substrate plate that extends to substantially the outer rim of the substrate plate;
a disk holder to which the conditioning disk is mounted, the disk holder including a through hole, the second surface of the substrate plate facing the disk holder; and
a disk arm to which the conditioning disk is mounted, the disk arm including an opening, the opening extending along a lengthwise direction of the disk arm, the opening being coupled to a vacuum module for evacuating debris and slurry through the at least one channel segment, the through hole and the opening, the opening being in fluid communication with the at least one channel segment via the through hole.