| CPC B24B 37/20 (2013.01) [B24B 37/32 (2013.01)] | 9 Claims |
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1. A polishing treatment device, comprising:
a polishing table having a polishing pad;
a polishing head that holds a substrate to be polished and brings a polished surface of the substrate into sliding contact with the polishing pad; and
a processor that controls the polishing head, wherein
the polishing head comprises:
a head housing that has
a first flange part that extends outward from an upper position of a circumferential surface of a cylindrical body and
a second flange part that extends outward from a lower position of the circumferential surface;
an annular body that is sized to surround an outer circumference of the second flange part and has a third flange part that is formed at an upper end part thereof and located between the first flange part and the second flange part;
an elastic body that covers a lower end-side opening part of the annular body and holds the substrate with a backing film pasted to a front surface thereof interposed therebetween;
a retainer ring formed in a shape to surround an outer circumference of the substrate;
driving means that integrally horizontally rotates the head housing, the annular body, and the retainer ring;
an annular elastic body being arranged on a back surface of the elastic body; and
a corrective pressing ring that applies a pressure to an upper surface of the annular elastic body being arranged inside the annular body,
the polishing head further comprises:
first pressure adjusting means that adjusts a processing pressure applied to a back side of the substrate opposite to the polished surface by adjusting a pressure in a space surrounded by the head housing, the annular body, and the elastic body;
second pressure adjusting means that adjusts a pressure applied to the polishing pad by the retainer ring by means of the first flange part;
third pressure adjusting means that adjusts, by means of the second flange part, a processing pressure applied to a back-side circumference of the substrate opposite to the polished surface by raising or lowering the annular body via the third flange part; and
fourth pressure adjusting means that adjusts, by means of the second flange part, a compensating pressure applied to a back-side outer circumference vicinity of the substrate opposite to the polished surface by the corrective pressing ring via the annular elastic body, and
as a first step, the processor
controls the first pressure adjusting means to apply the processing pressure to the back side of the substrate opposite to the polished surface,
controls the second pressure adjusting means to apply the pressure to the polishing pad, and
controls the third pressure adjusting means to raise the annular body to reduce the processing pressure on the back-side circumference of the substrate opposite to the polished surface compared with the processing pressure applied by the first pressure adjusting means, and
as a second step, the processor
controls the first pressure adjusting means to stop applying the processing pressure,
controls the second pressure adjusting means to apply the pressure to the polishing pad,
controls the third pressure adjusting means to lower the annular body to stop reducing the processing pressure on the back-side circumference of the substrate opposite to the polished surface, and
controls the fourth pressure adjusting means to apply the compensating pressure to the back-side outer circumference vicinity of the substrate opposite to the polished surface.
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