US 12,240,060 B2
SnIn solder alloys
Francis M. Mutuku, Utica, NY (US); Ning-Cheng Lee, Utica, NY (US); and Hongwen Zhang, Utica, NY (US)
Assigned to INDIUM CORPORATION, Utica, NY (US)
Filed by INDIUM CORPORATION, Utica, NY (US)
Filed on Jul. 29, 2022, as Appl. No. 17/877,437.
Application 17/877,437 is a division of application No. 16/557,587, filed on Aug. 30, 2019, granted, now 11,999,018.
Claims priority of provisional application 62/726,181, filed on Aug. 31, 2018.
Prior Publication US 2022/0362890 A1, Nov. 17, 2022
Int. Cl. B23K 35/26 (2006.01); B23K 35/02 (2006.01); B23K 101/42 (2006.01); C22C 12/00 (2006.01); C22C 13/02 (2006.01); C22C 30/06 (2006.01)
CPC B23K 35/262 (2013.01) [B23K 35/0244 (2013.01); B23K 35/025 (2013.01); B23K 35/264 (2013.01); C22C 12/00 (2013.01); C22C 13/02 (2013.01); C22C 30/06 (2013.01); B23K 2101/42 (2018.08)] 19 Claims
OG exemplary drawing
 
1. A solder alloy, consisting of:
12.5 to 18 wt % In;
1.0 wt % to 4.0 wt % Ag;
greater than 0 wt % to 3 wt % Cu;
3.4 wt % to 12 wt % Bi;
greater than 0 wt % to 5 wt % Sb;
greater than 0 wt % to 1.5 wt % Ni;
optionally, one or more of greater than 0 wt % to 2.5 wt % Zn, greater than 0 wt % to 1.5 wt % Co, greater than 0 wt % to 1.5 wt % Ge, greater than 0 wt % to 1.5 wt % P, and greater than 0 wt % to 1.5 wt % Mn; and
a remainder of Sn, wherein the solder alloy has a liquidus temperature below 210° C.