US 12,239,178 B2
Dermal heatsink exhibiting hydrophilic and contaminant resistant properties and method for fabricating a dermal heatsink
Gustavo Cadena Schlam, Monterrey (MX); and Michel Romero Flores, Monterrey (MX)
Assigned to Omius Inc., Palo Alto, CA (US)
Filed by Omius Inc., Palo Alto, CA (US)
Filed on Mar. 21, 2023, as Appl. No. 18/124,283.
Application 18/124,283 is a continuation of application No. 17/037,457, filed on Sep. 29, 2020, granted, now 11,632,996.
Application 17/037,457 is a continuation of application No. 16/574,048, filed on Sep. 17, 2019, granted, now 10,820,652, issued on Nov. 3, 2020.
Claims priority of provisional application 62/732,193, filed on Sep. 17, 2018.
Prior Publication US 2023/0329383 A1, Oct. 19, 2023
Int. Cl. A61F 7/00 (2006.01); A41D 13/005 (2006.01); A41D 20/00 (2006.01); A42B 1/008 (2021.01); B05D 3/00 (2006.01); B05D 3/04 (2006.01); B05D 3/10 (2006.01); B23P 15/26 (2006.01); B32B 5/18 (2006.01); F28F 13/00 (2006.01); F28F 13/18 (2006.01); A41D 1/04 (2006.01); B05D 3/02 (2006.01); C04B 28/00 (2006.01); C04B 28/18 (2006.01); F28D 21/00 (2006.01)
CPC A42B 1/008 (2013.01) [A41D 13/0053 (2013.01); A41D 13/0056 (2013.01); A41D 20/005 (2013.01); A61F 7/00 (2013.01); B05D 3/002 (2013.01); B05D 3/007 (2013.01); B05D 3/0453 (2013.01); B05D 3/107 (2013.01); B05D 3/108 (2013.01); B23P 15/26 (2013.01); F28F 13/003 (2013.01); F28F 13/185 (2013.01); A41D 1/04 (2013.01); A41D 13/0058 (2013.01); A41D 2300/20 (2013.01); A61F 2007/0001 (2013.01); A61F 2007/0007 (2013.01); A61F 2007/0018 (2013.01); A61F 2007/0034 (2013.01); A61F 2007/0098 (2013.01); B05D 3/0254 (2013.01); B05D 2203/30 (2013.01); C04B 28/005 (2013.01); C04B 28/182 (2013.01); F28D 2021/0029 (2013.01); F28F 2245/02 (2013.01); F28F 2260/00 (2013.01); Y10T 428/12479 (2015.01); Y10T 428/24008 (2015.01); Y10T 428/24017 (2015.01); Y10T 428/24174 (2015.01); Y10T 428/24331 (2015.01); Y10T 428/24339 (2015.01); Y10T 428/2457 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/249967 (2015.04); Y10T 428/249968 (2015.04); Y10T 428/249981 (2015.04)] 18 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a heatsink comprising:
a substrate comprising a thermally conductive material and defining:
an interior surface configured to thermally couple to a heat source;
an exterior surface; and
a network of pores extending between the interior surface and the exterior surface; and
a coating:
comprising a porous, hydrophilic material;
extending across surfaces of the substrate; and
lining the network of pores;
configured to cooperate with the substrate to wick moisture from a surface of the heat source, through the network of pores, to the exterior surface;
a textile panel defining an aperture configured to receive the heatsink with the interior surface of the substrate approximately coplanar the textile panel; and
a heatsink retainer coupled to a perimeter of the heatsink and configured to mate with the textile panel to retain the heatsink within the aperture.