US 11,917,808 B2
Semiconductor device and method of forming the same
Mitsunari Sukekawa, Higashihiroshima (JP)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by MICRON TECHNOLOGY, INC., Boise, ID (US)
Filed on Sep. 24, 2021, as Appl. No. 17/484,757.
Prior Publication US 2023/0098062 A1, Mar. 30, 2023
Int. Cl. H01L 27/108 (2006.01); H10B 12/00 (2023.01); G11C 5/10 (2006.01); H01L 29/423 (2006.01); G11C 11/402 (2006.01)
CPC H10B 12/30 (2023.02) [G11C 5/10 (2013.01); G11C 11/4023 (2013.01); H01L 29/42372 (2013.01); H10B 12/03 (2023.02)] 14 Claims
OG exemplary drawing
 
1. An apparatus comprising: a semiconductor substrate; an access transistor including channel, source and drain regions arranged in a vertical direction to the semiconductor substrate and a gate-electrode facing to the channel region; a storage capacitor coupled to one of the source and drain regions; a plurality of bit-lines including a bit-line coupled to the other of the source and drain regions; an air gap between adjacent two of the plurality of bit-lines, the air gap and the plurality of bit-lines in a same insulating layer; and a pull-out-electrode connected to the bit-line, wherein surfaces of the source and drain regions and the pull-out-electrode on the bit-line side is arranged at substantially the same height from the upper surface of the semiconductor substrate.