US 11,917,796 B2
Heat sink for liquid cooling
Nathan Longhurst, Rotherham (GB); Jason Matteson, Raleigh, NC (US); and David Amos, Sheffield (GB)
Assigned to Iceotope Group Limited, Rotherham (GB)
Appl. No. 17/777,242
Filed by ICEOTOPE GROUP LIMITED, Rotherham (GB)
PCT Filed Nov. 18, 2020, PCT No. PCT/GB2020/052931
§ 371(c)(1), (2) Date May 16, 2022,
PCT Pub. No. WO2021/099770, PCT Pub. Date May 27, 2021.
Claims priority of application No. 1916771 (GB), filed on Nov. 18, 2019.
Prior Publication US 2022/0408609 A1, Dec. 22, 2022
Int. Cl. H05K 7/20 (2006.01); H01L 23/473 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/20772 (2013.01) [H05K 7/20236 (2013.01); H01L 23/473 (2013.01); H01L 23/4735 (2013.01); H05K 1/0203 (2013.01); H05K 7/20254 (2013.01); H05K 2201/066 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A module for housing electronic devices and a liquid coolant, the module comprising:
a housing defining a sealable chassis for containing the electronic devices and the liquid coolant, the sealable chassis having a base;
a substrate in the sealable chassis approximately parallel to the base, one of the electronic devices being mounted on an underside of the substrate proximal the base; and
a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein so that the liquid coolant in the receptacle part is higher than a level of liquid coolant in the base, the heat sink device being mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume so as to be in contact with the liquid coolant.