US 11,917,790 B2
Thermal control for processor-based devices
Prabhakar Subrahmanyam, San Jose, CA (US); Casey Winkel, Hillsboro, OR (US); Yingqiong Bu, Shanghai (CN); Ming Zhang, Shanghai (CN); Yuehong Fan, Shanghai (CN); Yi Xia, Campbell, CA (US); and Ying-Feng Pang, San Jose, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Apr. 27, 2020, as Appl. No. 16/859,202.
Claims priority of provisional application 62/914,325, filed on Oct. 11, 2019.
Claims priority of provisional application 62/839,515, filed on Apr. 26, 2019.
Prior Publication US 2020/0260613 A1, Aug. 13, 2020
Prior Publication US 2021/0289659 A2, Sep. 16, 2021
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20154 (2013.01) [H05K 7/209 (2013.01); H05K 7/20209 (2013.01); H05K 7/20927 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A two-part, separable, heat sink system, comprising:
a first heat sink having a first surface and a second surface, the first surface opposite the second surface, the second surface of the first heat sink thermally couplable to a thermally emissive device coupled to a substrate, the first heat sink including a plurality of fins;
a second heat sink having a third surface and a fourth surface, the third surface opposite the fourth surface; and
a thermal interface member to thermally couple the first heat sink to the second heat sink, the thermal interface member to be disposed betweeen the plurality of fins and the second heat sink, the thermal interface member to be on an opposite of the first heat sink as the substrate.