CPC H05K 7/20154 (2013.01) [H05K 7/209 (2013.01); H05K 7/20209 (2013.01); H05K 7/20927 (2013.01)] | 22 Claims |
1. A two-part, separable, heat sink system, comprising:
a first heat sink having a first surface and a second surface, the first surface opposite the second surface, the second surface of the first heat sink thermally couplable to a thermally emissive device coupled to a substrate, the first heat sink including a plurality of fins;
a second heat sink having a third surface and a fourth surface, the third surface opposite the fourth surface; and
a thermal interface member to thermally couple the first heat sink to the second heat sink, the thermal interface member to be disposed betweeen the plurality of fins and the second heat sink, the thermal interface member to be on an opposite of the first heat sink as the substrate.
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