CPC H05K 1/0353 (2013.01) [B32B 15/09 (2013.01); B32B 15/20 (2013.01); C08G 63/605 (2013.01); C08L 67/04 (2013.01); H01Q 1/243 (2013.01); H05K 1/09 (2013.01); B32B 2307/202 (2013.01); B32B 2307/204 (2013.01); B32B 2307/73 (2013.01); B32B 2457/08 (2013.01); C08G 2250/00 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2205/14 (2013.01); H01Q 21/065 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10522 (2013.01)] | 37 Claims |
1. A laminate for use in a circuit board, the laminate comprising:
a conductive layer; and
a film positioned adjacent to the conductive layer, wherein the film comprises a polymer composition that includes a polymer matrix comprising a liquid crystalline polymer and a hydrophobic material distributed throughout the polymer matrix, wherein the polymer composition exhibits a dielectric constant of about 5 or less and dissipation factor of about 0.05 or less at a frequency of 10 GHz, wherein the liquid crystalline polymer contains repeating units derived from 6-hydroxy-2-naphthoic acid in an amount of about 30 mol. % or more.
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