US 11,917,746 B2
Low cost panel AESA with thermal management
Miroslav Micovic, Marana, AZ (US); Brandon W. Pillans, Plano, TX (US); Andrew D. Gamalski, Tucson, AZ (US); and Andrew K. Brown, Hesperia, CA (US)
Assigned to Raytheon Company, Waltham, MA (US)
Filed by Raytheon Company, Waltham, MA (US)
Filed on Apr. 22, 2022, as Appl. No. 17/660,261.
Prior Publication US 2023/0345616 A1, Oct. 26, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 3/20 (2006.01); H05K 3/34 (2006.01)
CPC H05K 1/0209 (2013.01) [H05K 1/023 (2013.01); H05K 1/0298 (2013.01); H05K 3/205 (2013.01); H05K 3/3436 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/064 (2013.01); H05K 2203/043 (2013.01); H05K 2203/1453 (2013.01); H05K 2203/304 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling apparatus, comprising:
a structure configured for coupling to a first side of a printed circuit board (PCB) having first and second sides and having at least a power dissipating component operably coupled to the first side, the power dissipating component having an underside comprising a plurality of solder contacts in operable communication with the PCB, wherein the structure comprises a thermally and electrically conductive material and is configured to define and separate first and second regions of the PCB when the structure is attached to the PCB, wherein the first region of the PCB is configured to surround the power dissipating component and the second region of the PCB lies outside of the structure and does not include the power dissipating component; and
an electrically and thermally conductive continuous sheet of material thermally and electrically coupled to the structure and configured to be in void-free thermal contact with the power dissipating component and in void-free thermal contact with all areas in the first region of the PCB that do not contain the power dissipating component, wherein the structure and the electrically and thermally conductive sheet of material, when thermally and electrically coupled together, form a heat exchanger.