US 11,917,744 B2
Heat management for inductively coupled plasma systems
Tak Shun Cheung, Woodbridge (CA); Chui Ha Cindy Wong, Woodbridge (CA); William Fisher, Woodbridge (CA); and Hamid Badiei, Woodbridge (CA)
Assigned to PERKINELMER SCIENTIFIC CANADA ULC, Woodbridge (CA)
Filed by PERKINELMER SCIENTIFIC CANADA ULC, Woodbridge (CA)
Filed on Jul. 22, 2021, as Appl. No. 17/383,060.
Prior Publication US 2023/0028640 A1, Jan. 26, 2023
Int. Cl. H05H 1/28 (2006.01); H01J 49/10 (2006.01); H05H 1/46 (2006.01); H01J 49/04 (2006.01); G01J 3/44 (2006.01); G01J 3/443 (2006.01)
CPC H05H 1/28 (2013.01) [H01J 49/0468 (2013.01); H01J 49/105 (2013.01); H05H 1/4652 (2021.05); G01J 3/443 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A system for cooling an inductively coupled plasma (ICP) instrument, the system comprising:
the ICP instrument;
a pump in fluid communication with the instrument via a first conduit; and
a micro-channel heat exchanger in fluid communication with the instrument via a second conduit, and in fluid communication with the pump via a third conduit,
wherein the pump is configured to generate a pump outlet pressure of coolant that exceeds a back pressure of the instrument such that a pressure of the coolant traveling through the second conduit and into the heat exchanger is less than or equal to 5 pounds per square inch (psi) above atmospheric pressure, as measured at an inlet to the heat exchanger.