US 11,917,347 B2
Electronic device including acoustic module
Heecheul Moon, Suwon-si (KR); Sangyoup Seok, Suwon-si (KR); Kwonho Son, Suwon-si (KR); and Jongchul Choi, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Oct. 24, 2022, as Appl. No. 17/971,733.
Application 17/971,733 is a continuation of application No. 16/861,703, filed on Apr. 29, 2020, granted, now 11,483,637.
Claims priority of application No. 10-2019-0079447 (KR), filed on Jul. 2, 2019.
Prior Publication US 2023/0044796 A1, Feb. 9, 2023
Int. Cl. H04R 1/02 (2006.01); G06F 1/16 (2006.01); H04N 23/57 (2023.01)
CPC H04R 1/02 (2013.01) [G06F 1/1637 (2013.01); H04N 23/57 (2023.01); H04R 2499/11 (2013.01); H04R 2499/15 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a lateral member forming at least a part of a lateral side of the electronic device;
a cover at least partially disposed on the lateral member;
an acoustic module disposed in an internal space of the electronic device;
at least one first opening provided through at least a portion of the lateral side in the lateral member;
a second opening provided through a space between the lateral member and the cover;
an electronic component disposed in the internal space adjacent to the second opening; and
an acoustic path configured to guide sound generated from the acoustic module to an outside through the at least one first opening and the second opening,
wherein the acoustic path includes:
a first space at least partially disposed proximate the electronic component, when the cover is viewed from above;
a second space that connects the first space to the at least one first opening, wherein at least part of the second space and the first space are arranged to form a first acoustic path, when the cover is viewed from above; and
a third space that is branched from the first acoustic path to be connected to the second opening and is configured to change direction of sound from the first acoustic path toward the electronic component along the lateral member so as to bypass the electronic component, when the cover is viewed from above.