US 11,917,278 B2
Camera module of reduced size and method for manufacturing the same
Man-Zhi Peng, Huaian (CN); Rui-Wu Liu, Huaian (CN); and Jia-He Li, Shenzhen (CN)
Assigned to HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Qinhuangdao (CN); and Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN)
Filed by HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Qinhuangdao (CN); and Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN)
Filed on Apr. 11, 2022, as Appl. No. 17/717,334.
Application 17/717,334 is a continuation in part of application No. PCT/CN2020/097798, filed on Jun. 23, 2020.
Prior Publication US 2022/0232152 A1, Jul. 21, 2022
Int. Cl. H04N 23/55 (2023.01); H04N 23/54 (2023.01)
CPC H04N 23/55 (2023.01) [H04N 23/54 (2023.01)] 16 Claims
OG exemplary drawing
 
1. A lens module comprising:
a baseplate defining a receiving hole;
an image sensor disposed on the baseplate and corresponding in position to the receiving hole;
a mounting bracket disposed on the baseplate and defining a through hole, wherein an inner wall of the through hole extends towards a central axis of the through hole to form a platform, and a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion;
a multilayer coil surrounding the through hole, wherein the multilayer coil comprises a plurality of layers of encircling coils arranged on the mounting bracket from inside to outside;
a capacitor arranged on the mounting bracket;
a resistor arranged on the mounting bracket, wherein the multilayer coil, the capacitor, and the resistor are formed by laser direct structuring;
an optical filter disposed on the platform and accommodated in the through hole;
a lens disposed in the through hole; and
a circuit board connected with the mounting bracket through the connecting portion.