CPC H04N 23/55 (2023.01) [H04N 23/54 (2023.01)] | 16 Claims |
1. A lens module comprising:
a baseplate defining a receiving hole;
an image sensor disposed on the baseplate and corresponding in position to the receiving hole;
a mounting bracket disposed on the baseplate and defining a through hole, wherein an inner wall of the through hole extends towards a central axis of the through hole to form a platform, and a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion;
a multilayer coil surrounding the through hole, wherein the multilayer coil comprises a plurality of layers of encircling coils arranged on the mounting bracket from inside to outside;
a capacitor arranged on the mounting bracket;
a resistor arranged on the mounting bracket, wherein the multilayer coil, the capacitor, and the resistor are formed by laser direct structuring;
an optical filter disposed on the platform and accommodated in the through hole;
a lens disposed in the through hole; and
a circuit board connected with the mounting bracket through the connecting portion.
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