US 11,916,534 B2
Microelectromechanical resonator
Joseph C. Doll, Mountain View, CA (US); Nicholas Miller, Sunnyvale, CA (US); Charles I. Grosjean, Los Gatos, CA (US); Paul M. Hagelin, Saratoga, CA (US); and Ginel C. Hill, Sunnyvale, CA (US)
Assigned to SiTime Corporation, Santa Clara, CA (US)
Filed by SiTime Coporation, Santa Clara, CA (US)
Filed on Jun. 23, 2022, as Appl. No. 17/847,438.
Application 17/847,438 is a division of application No. 17/544,120, filed on Dec. 7, 2021, granted, now 11,677,379.
Application 17/544,120 is a division of application No. 16/245,184, filed on Jan. 10, 2019, granted, now 11,228,298, issued on Jan. 18, 2022.
Application 16/245,184 is a division of application No. 15/497,146, filed on Apr. 25, 2017, granted, now 10,218,333, issued on Feb. 26, 2019.
Application 15/497,146 is a division of application No. 15/186,510, filed on Jun. 19, 2016, granted, now 9,712,128, issued on Jul. 18, 2017.
Application 15/186,510 is a continuation in part of application No. 14/617,753, filed on Feb. 9, 2015, granted, now 9,705,470, issued on Jul. 11, 2017.
Claims priority of provisional application 62/183,689, filed on Jun. 23, 2015.
Claims priority of provisional application 62/181,767, filed on Jun. 19, 2015.
Claims priority of provisional application 61/937,601, filed on Feb. 9, 2014.
Prior Publication US 2022/0337218 A1, Oct. 20, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H03H 9/125 (2006.01); H03H 3/007 (2006.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/24 (2006.01); H03H 9/17 (2006.01); H03H 3/02 (2006.01); H03H 9/15 (2006.01)
CPC H03H 9/125 (2013.01) [H03H 3/0077 (2013.01); H03H 9/02259 (2013.01); H03H 9/02401 (2013.01); H03H 9/02448 (2013.01); H03H 9/1057 (2013.01); H03H 9/17 (2013.01); H03H 9/2463 (2013.01); H03H 2003/027 (2013.01); H03H 2009/02181 (2013.01); H03H 2009/02307 (2013.01); H03H 2009/155 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A device comprising:
a die;
a microelectromechanical systems (MEMS) resonator on the die, the MEMS resonator including a body having a layer of degenerately doped silicon, the body also having a piezoelectric material layer, the body to vibrate at a frequency during operation of the MEMS resonator, the frequency having a temperature dependent characteristic; and
a heating element to heat the MEMS resonator.