US 11,916,322 B2
Dual-sided socket device with corrugation structures
Srikant Nekkanty, Chandler, AZ (US); Steven Klein, Chandler, AZ (US); and Feroz Mohammad, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 25, 2020, as Appl. No. 17/032,595.
Prior Publication US 2022/0102883 A1, Mar. 31, 2022
Int. Cl. H01R 12/71 (2011.01); H01R 43/26 (2006.01)
CPC H01R 12/714 (2013.01) [H01R 43/26 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A socket device comprising:
a socket body structure comprising a first side, and a second side opposite the first side;
a first plurality of metallization structures which each extend vertically from the first side, wherein a pitch of the first plurality of metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm; and
a second plurality of metallization structures which each extend vertically from the second side, the second plurality of metallization structures each electrically coupled to a respective one of the first plurality of metallization structures;
wherein, for each of the first plurality of metallization structures, a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm, a portion of a side of the metallization structure forms a respective corrugation structure, and a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.