US 11,916,176 B2
Wavelength conversion component
Yukitoshi Marutani, Anan (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Jul. 25, 2022, as Appl. No. 17/873,124.
Application 17/873,124 is a continuation of application No. 16/750,868, filed on Jan. 23, 2020, granted, now 11,430,924.
Claims priority of application No. 2019-014454 (JP), filed on Jan. 30, 2019.
Prior Publication US 2022/0359797 A1, Nov. 10, 2022
Int. Cl. H01L 33/50 (2010.01); H01L 33/64 (2010.01); H01L 33/58 (2010.01)
CPC H01L 33/504 (2013.01) [H01L 33/502 (2013.01); H01L 33/505 (2013.01); H01L 33/507 (2013.01); H01L 33/58 (2013.01); H01L 33/644 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A wavelength conversion component comprising:
a plurality of semiconductor multilayer film segments;
a first member arranged between adjacent ones of the semiconductor multilayer film segments; and
a substrate disposed above the plurality of semiconductor multilayer film segments, the substrate defining a groove, wherein
each of the semiconductor multilayer film segments is configured to receive light, convert a wavelength of the light received, and allow a wavelength-converted light to exit toward the substrate.