US 11,916,013 B2
Via interconnects including super vias
Yann Mignot, Slingerlands, NY (US); Christopher J. Waskiewicz, Rexford, NY (US); Eric Miller, Watervliet, NY (US); and Chanro Park, Clifton Park, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Sep. 2, 2021, as Appl. No. 17/465,815.
Prior Publication US 2023/0065078 A1, Mar. 2, 2023
Int. Cl. H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01)
CPC H01L 23/5226 (2013.01) [H01L 21/76808 (2013.01); H01L 21/76816 (2013.01); H01L 21/76834 (2013.01); H01L 21/76892 (2013.01); H01L 21/76897 (2013.01); H01L 23/5283 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An interconnect structure comprising:
a first interconnect layer including a first dielectric layer and a first metal layer;
a second interconnect layer including a second dielectric layer and a second metal layer;
a first dielectric cap layer between the first interconnect layer and the second interconnect layer;
a placeholder via extending through the second interconnect layer and the first dielectric cap layer, the placeholder via containing sacrificial placeholder material;
a second dielectric cap layer over the second dielectric layer;
a patterned third dielectric layer over the second dielectric cap layer, the patterned third dielectric layer including an upper super via portion vertically aligned with the placeholder via, the placeholder via comprising a bottom super via portion, the bottom super via portion and the upper super via portion providing portions of a super via extending from the third dielectric layer to the first interconnect layer.