US 11,916,003 B2
Varied ball ball-grid-array (BGA) packages
Xiao Lu, Chandler, AZ (US); Jiongxin Lu, Chandler, AZ (US); Christopher Combs, Portland, OR (US); Alexander Huettis, Aloha, OR (US); John Harper, Chandler, AZ (US); Jieping Zhang, Mesa, AZ (US); Nachiket R. Raravikar, Gilbert, AZ (US); Pramod Malatkar, Chandler, AZ (US); Steven A. Klein, Chandler, AZ (US); Carl Deppisch, Tempe, AZ (US); and Mohit Sood, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 18, 2019, as Appl. No. 16/575,307.
Prior Publication US 2021/0082798 A1, Mar. 18, 2021
Int. Cl. H01L 23/48 (2006.01); B23K 3/06 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/49833 (2013.01) [B23K 3/0623 (2013.01); H01L 23/49822 (2013.01); H01L 23/4985 (2013.01); H01L 23/5387 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a first substrate;
a second substrate; and
an array of interconnects electrically coupling the first substrate to the second substrate, wherein the array of interconnects comprises:
first interconnects, wherein the first interconnects have a first material composition; and
second interconnects, wherein the second interconnects have a second material composition, wherein the first material composition is different than the second material composition, and wherein the second interconnects each comprise a core, and solder completely surrounding the core, the solder having a material composition different than the first material composition.