US 11,915,963 B2
Protective member forming apparatus
Yoshinori Kakinuma, Tokyo (JP); and Yoshikuni Migiyama, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Aug. 3, 2021, as Appl. No. 17/392,491.
Claims priority of application No. 2020-140466 (JP), filed on Aug. 21, 2020.
Prior Publication US 2022/0059390 A1, Feb. 24, 2022
Int. Cl. H01L 21/683 (2006.01); B28D 5/00 (2006.01)
CPC H01L 21/6836 (2013.01) [B28D 5/0064 (2013.01); B28D 5/0082 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A protective member forming apparatus for forming a protective member on one surface of a wafer, the protective member forming apparatus comprising:
an integrating unit that supplies a liquid resin curable by an external stimulus to a sheet larger than the wafer held by a chuck table, spreads the resin on a surface of the wafer, and cures the resin by an external stimulus, to integrate the sheet with the wafer by the resin;
a conveying unit that conveys the wafer integrated with the sheet; and
a cutting unit that holds, by a cutting table, the wafer integrated with the sheet conveyed by the conveying unit and cuts the sheet by a cutting section along a periphery of the wafer,
wherein the cutting unit includes
a detection unit that images the wafer by a camera and detects a position of a peripheral edge of the wafer, and
a control unit configured to cut the sheet on an outer circumferential side of the wafer using the cutting section only in a case where the peripheral edge of the wafer detected by the camera coincides with a track of the cutting section when the integrated sheet is cut, the control unit is configured to store a position of the track of the cutting section which is preliminarily imaged and acquired by the camera.