US 11,915,958 B2
Apparatus and method for automated wafer carrier handling
Ren-Hau Wu, New Taipei (TW); Cheng-Lung Wu, Hsinchu (TW); Jiun-Rong Pai, Hsinchu County (TW); and Cheng-Kang Hu, Kaohsiung (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 25, 2022, as Appl. No. 17/704,014.
Application 17/704,014 is a division of application No. 16/787,028, filed on Feb. 11, 2020, granted, now 11,295,973.
Prior Publication US 2022/0216075 A1, Jul. 7, 2022
Int. Cl. H01L 21/677 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/6773 (2013.01) [H01L 21/67259 (2013.01); H01L 21/67715 (2013.01); H01L 21/67733 (2013.01); H01L 21/67736 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An operation method for automated wafer carrier handling, comprising:
bring a base frame and an engaging mechanism of an automated wafer carrier handling apparatus into abutting contact with a top flange mounted on a wafer carrier to limit at least one degree of freedom of movement of the top flange, wherein the engaging mechanism changes from a contracted form to an expanded form to be engaged with the top flange;
transporting the wafer carrier to a destination location by the automated wafer carrier handling apparatus; and
releasing the top flange mounted on the wafer carrier from the automated wafer carrier handling apparatus at the destination location.