CPC H01L 21/6773 (2013.01) [H01L 21/67259 (2013.01); H01L 21/67715 (2013.01); H01L 21/67733 (2013.01); H01L 21/67736 (2013.01)] | 20 Claims |
1. An operation method for automated wafer carrier handling, comprising:
bring a base frame and an engaging mechanism of an automated wafer carrier handling apparatus into abutting contact with a top flange mounted on a wafer carrier to limit at least one degree of freedom of movement of the top flange, wherein the engaging mechanism changes from a contracted form to an expanded form to be engaged with the top flange;
transporting the wafer carrier to a destination location by the automated wafer carrier handling apparatus; and
releasing the top flange mounted on the wafer carrier from the automated wafer carrier handling apparatus at the destination location.
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