US 11,915,957 B2
Multiple semiconductor die container load port
Chih-Hung Huang, Hsinchu County (TW); Cheng-Lung Wu, Zhunan Township (TW); Yi-Fam Shiu, Toufen (TW); Yu-Chen Chen, Hemei Township (TW); Yang-Ann Chu, Hsinchu (TW); and Jiun-Rong Pai, Jhubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed on Jan. 7, 2022, as Appl. No. 17/647,367.
Application 17/647,367 is a continuation of application No. 16/912,991, filed on Jun. 26, 2020, granted, now 11,222,802.
Prior Publication US 2022/0208570 A1, Jun. 30, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/677 (2006.01); H01L 23/04 (2006.01); G05D 5/04 (2006.01); B23Q 15/00 (2006.01); B23Q 16/00 (2006.01)
CPC H01L 21/6773 (2013.01) [B23Q 15/00 (2013.01); B23Q 16/00 (2013.01); G05D 5/04 (2013.01); H01L 21/67736 (2013.01); H01L 21/67778 (2013.01); H01L 23/04 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A load port, comprising:
a housing;
one or more elevators;
a stage moveable within the housing by the one or more elevators,
wherein the stage includes a mechanism to support multiple types of die containers,
wherein the stage includes:
a first portion movable by the one or more elevators to accommodate a first die container type of the multiple types of die containers, and
a second portion movable by the one or more elevators to accommodate a second die container type of the multiple types of die containers,
wherein the first die container type and the second die container type have different outer dimensions; and
a position sensor configured to identify a type of a die container positioned on the stage.