US 11,915,954 B2
Multi-flip semiconductor die sorter tool
Chih-Hung Huang, Hsinchu (TW); Cheng-Lung Wu, Zhunan Township (TW); Zheng-Lin He, Hsinchu (TW); Yang-Ann Chu, Hsinchu (TW); Jiun-Rong Pai, Jhubei (TW); and Hsuan Lee, Tainan (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jan. 30, 2023, as Appl. No. 18/161,242.
Application 18/161,242 is a continuation of application No. 16/901,595, filed on Jun. 15, 2020, granted, now 11,569,105.
Prior Publication US 2023/0170234 A1, Jun. 1, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); B07C 5/34 (2006.01); G01R 31/01 (2020.01); H01L 21/677 (2006.01)
CPC H01L 21/67271 (2013.01) [B07C 5/3412 (2013.01); G01R 31/01 (2013.01); H01L 21/67703 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A die sorter tool, comprising:
a first lane to receive, from one or more load ports, a carrier with a set of dies;
a die flip module to:
receive the carrier,
manipulate one or more dies of the set of dies, and
return the one or more dies to the carrier after manipulating the one or more dies; and
a second lane to:
receive the carrier from the die flip module, and
provide the carrier to the one or more load ports.