CPC H01L 21/67103 (2013.01) [H01J 37/32642 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/68735 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); H01J 2237/002 (2013.01); H01J 2237/332 (2013.01)] | 20 Claims |
1. A substrate support assembly comprising:
a top puck;
a plurality of heaters coupled to the top puck, wherein the heaters comprise resistive heaters extending across a back surface of the top puck;
a cooling plate coupled with the plurality of heaters at a first surface of the cooling plate, wherein the cooling plate defines a channel configured to distribute a temperature controlled fluid through the cooling plate;
an insulator coupled with a second surface of the cooling plate opposite the first surface, wherein the insulator is coupled with the cooling plate along a first surface of the insulator; and
a back plate coupled with a second surface of the insulator opposite the first surface of the insulator.
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