US 11,915,950 B2
Multi-zone semiconductor substrate supports
Mehmet Tugrul Samir, Mountain View, CA (US); Dongqing Yang, San Jose, CA (US); Dmitry Lubomirsky, Cupertino, CA (US); Peter Hillman, Santa Clara, CA (US); Soonam Park, Sunnyvale, CA (US); Martin Yue Choy, San Ramon, CA (US); and Lala Zhu, Fremont, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jan. 25, 2022, as Appl. No. 17/583,935.
Application 17/583,935 is a division of application No. 15/597,949, filed on May 17, 2017, granted, now 11,276,590.
Prior Publication US 2022/0148894 A1, May 12, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01J 37/32 (2006.01)
CPC H01L 21/67103 (2013.01) [H01J 37/32642 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/68735 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); H01J 2237/002 (2013.01); H01J 2237/332 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate support assembly comprising:
a top puck;
a plurality of heaters coupled to the top puck, wherein the heaters comprise resistive heaters extending across a back surface of the top puck;
a cooling plate coupled with the plurality of heaters at a first surface of the cooling plate, wherein the cooling plate defines a channel configured to distribute a temperature controlled fluid through the cooling plate;
an insulator coupled with a second surface of the cooling plate opposite the first surface, wherein the insulator is coupled with the cooling plate along a first surface of the insulator; and
a back plate coupled with a second surface of the insulator opposite the first surface of the insulator.