US 11,915,926 B2
Percolation doping of inorganic-organic frameworks for multiple device applications
Leonidas Ernesto Ocola, Wappingers Falls, NY (US); Eric A. Joseph, Croton on Hudson, NY (US); Hiroyuki Miyazoe, White Plains, NY (US); Takashi Ando, Eastchester, NY (US); and Damon Brooks Farmer, White Plains, NY (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Sep. 27, 2021, as Appl. No. 17/485,659.
Prior Publication US 2023/0097847 A1, Mar. 30, 2023
Int. Cl. H01L 21/02 (2006.01); H01L 29/40 (2006.01); C23C 16/02 (2006.01); C23C 16/04 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01)
CPC H01L 21/02203 (2013.01) [C23C 16/0245 (2013.01); C23C 16/045 (2013.01); C23C 16/403 (2013.01); C23C 16/45525 (2013.01); H01L 21/02178 (2013.01); H01L 21/02181 (2013.01); H01L 29/408 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method to synthesize a porous thin film, the method comprising:
performing an oxidation process to remove carbon impurities from a framework such that pores are formed in the framework, each of the pores extending from an upper surface of the framework to a bottom surface contained in the framework; and
doping the framework by performing a high aspect ratio (HAR) atomic layer deposition (ALD) process to deposit a pore-coating film that coats sidewalls and a bottom surface of the pores,
wherein the HAR ALD process uses an oxidizer and is performed at a low temperature ranging from about 50 degrees Celsius (50° C.) to about 250° C. so as to form organic impurities comprising a carbon material, and
wherein a thickness of the pore-coating film defines an inner thickness of the pores.
 
9. A method to synthesize a porous thin film, the method comprising:
forming a non-organic framework including a plurality of organic impurities, the organic impurities extending from a first end located at an upper surface of the framework to a second end contained in the framework;
removing the organic impurities to form pores extending from the upper surface of the framework to a bottom surface contained in the framework; and
coating sidewalls and the bottom surface of the pores with a pore-coating film,
wherein forming the non-organic framework includes performing an atomic layer deposition (ALD) process to deposit a metal oxide material on a substrate, the ALD process using an oxidizer that is performed at a low temperature ranging from about 50 degrees Celsius (50° C.) to about 250° C. so as to form the organic impurities comprising a carbon material.