US 11,913,383 B2
Thermal barrier coated component and method for producing thermal barrier coated component
Yoshifumi Okajima, Tokyo (JP); Masahiko Mega, Tokyo (JP); Taiji Torigoe, Tokyo (JP); Atsushi Moriwaki, Tokyo (JP); Hiroshi Makigano, Tokyo (JP); and Koichi Tanimoto, Tokyo (JP)
Assigned to MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo (JP)
Appl. No. 17/615,895
Filed by Mitsubishi Power, Ltd., Kanagawa (JP)
PCT Filed Jun. 12, 2020, PCT No. PCT/JP2020/023137
§ 371(c)(1), (2) Date Dec. 2, 2021,
PCT Pub. No. WO2021/002173, PCT Pub. Date Jan. 7, 2021.
Claims priority of application No. 2019-123678 (JP), filed on Jul. 2, 2019.
Prior Publication US 2022/0316401 A1, Oct. 6, 2022
Int. Cl. F02C 7/24 (2006.01); C23C 4/073 (2016.01); C23C 4/134 (2016.01); G01N 25/18 (2006.01); F01D 5/28 (2006.01); F01D 17/08 (2006.01); F01D 21/00 (2006.01)
CPC F02C 7/24 (2013.01) [C23C 4/073 (2016.01); C23C 4/134 (2016.01); F01D 5/288 (2013.01); F01D 17/085 (2013.01); F01D 21/003 (2013.01); G01N 25/18 (2013.01); F05D 2220/32 (2013.01); F05D 2230/312 (2013.01); F05D 2230/90 (2013.01); F05D 2260/231 (2013.01); F05D 2270/80 (2013.01); F05D 2300/2118 (2013.01); F05D 2300/514 (2013.01); F05D 2300/611 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A thermal barrier coated component comprising:
a base material;
a first bond coat layer that is a metal bonding layer formed on the base material;
a sensor unit disposed on the first bond coat layer and including a sensor and a conductive wire;
a second bond coat layer that is formed on the first bond coat layer so as to cover at least the sensor unit such that the sensor is arranged between the first bond coat layer and the second bond coat layer, wherein the second bond coat layer has a surface roughness higher than that of the first bond coat layer; and
a top coat layer that is formed on the second bond coat layer.