US 11,913,115 B2
Substrate processing apparatus and substrate processing method
Yoshitaka Miura, Oshu (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jul. 14, 2020, as Appl. No. 16/928,740.
Claims priority of application No. 2019-132099 (JP), filed on Jul. 17, 2019.
Prior Publication US 2021/0017646 A1, Jan. 21, 2021
Int. Cl. C23C 16/52 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/44 (2006.01)
CPC C23C 16/4588 (2013.01) [C23C 16/45544 (2013.01); C23C 16/45561 (2013.01); C23C 16/45578 (2013.01); C23C 16/52 (2013.01); C23C 16/4401 (2013.01); C23C 16/45589 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a processing container;
an injector provided inside the processing container and having a shape extending in a longitudinal direction, the injector configured to supply a processing gas;
a holder fixed to the injector;
a windmill fixed to the holder;
a first driving-gas supplier configured to supply a driving-gas that rotates the windmill in a first direction;
a second driving-gas supplier configured to supply the driving-gas that rotates the windmill in a second direction opposite the first direction; and
a driving-gas controller configured to control the supply of the driving-gas from the first driving-gas supplier and the second driving-gas supplier,
wherein the injector is rotated about the longitudinal direction corresponding to a rotational axis by rotating the windmill through the supply of the driving-gas from at least one of the first driving-gas supplier and the second driving-gas supplier under a control of the driving-gas controller, and
wherein the at least one of the first driving-gas supplier and the second driving-gas supplier supplies the driving-gas while the rotation of the injector is stopped by two pins near the holder.