US 11,912,897 B2
Electroconductive coating material and method for producing shielded package using said electroconductive coating material
Hajime Nakazono, Kyoto (JP); and Kazuhiro Matsuda, Kyoto (JP)
Assigned to Tatsuta Electric Wire & Cable Co., Ltd., Osaka (JP)
Appl. No. 17/044,146
Filed by Tatsuta Electric Wire & Cable Co., Ltd., Osaka (JP)
PCT Filed Feb. 18, 2019, PCT No. PCT/JP2019/005743
§ 371(c)(1), (2) Date Sep. 30, 2020,
PCT Pub. No. WO2019/198336, PCT Pub. Date Oct. 17, 2019.
Claims priority of application No. 2018-075422 (JP), filed on Apr. 10, 2018.
Prior Publication US 2021/0024758 A1, Jan. 28, 2021
Int. Cl. C09D 5/24 (2006.01); C09D 7/61 (2018.01); C08K 3/08 (2006.01); C08K 5/00 (2006.01); C09D 163/00 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/552 (2006.01); H01B 1/22 (2006.01); H05K 9/00 (2006.01); C09D 7/20 (2018.01); C08G 59/40 (2006.01); C08K 5/56 (2006.01); H01L 23/31 (2006.01)
CPC C09D 5/24 (2013.01) [C08G 59/4028 (2013.01); C08K 3/08 (2013.01); C08K 5/0091 (2013.01); C08K 5/56 (2013.01); C09D 7/20 (2018.01); C09D 7/61 (2018.01); C09D 163/00 (2013.01); H01B 1/22 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/552 (2013.01); H05K 9/00 (2013.01); H05K 9/0075 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0806 (2013.01); H01L 23/3121 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A conductive coating material comprising:
100 parts by weight of an epoxy resin-containing binder component (A);
500 to 2500 parts by weight of metal particles (B);
1 to 150 parts by weight of a curing agent (C);
20 to 800 parts by weight of a solvent (D); and
0.5 to 5 parts by weight of a curing catalyst (E), the curing catalyst (E) being an organic metal compound that is at least one selected from the group consisting of iron-2-ethylhexanoate, iron(III) acetylacetonate, zinc 2-ethylhexanoate, zinc naphthenate, and zinc(II) acetylacetonate.