	US 11,912,860 B2
	Highly loaded inorganic filled organic resin systems
Laura Beth Cook, Corning, NY (US); Laura Jeanne Cunneen, Lawrenceville, PA (US); Richard Curwood Peterson, Elmira Heights, NY (US); and Kathleen Ann Wexell, Corning, NY (US)
Assigned to CORNING INCORPORATED, Corning, NY (US)
Appl. No. 17/043,039
Filed by CORNING INCORPORATED, Corning, NY (US)
PCT Filed Mar. 29, 2019, PCT No. PCT/US2019/024801 § 371(c)(1), (2) Date Sep. 29, 2020, PCT Pub. No. WO2019/191564, PCT Pub. Date Oct. 3, 2019.
Claims priority of provisional application 62/649,819, filed on Mar. 29, 2018.
Prior Publication US 2021/0047510 A1, Feb. 18, 2021
Int. Cl. C08F 2/46 (2006.01); B29C 64/129 (2017.01); B29C 64/35 (2017.01); B33Y 70/10 (2020.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C08J 7/12 (2006.01); C08K 3/40 (2006.01); C08K 9/02 (2006.01); C08L 33/08 (2006.01); C08L 63/00 (2006.01); B29K 33/00 (2006.01); B29K 63/00 (2006.01)

CPC C08L 63/00 (2013.01) [B29C 64/129 (2017.08); B29C 64/35 (2017.08); B33Y 70/10 (2020.01); C08J 7/126 (2013.01); C08K 3/40 (2013.01); C08K 9/02 (2013.01); C08L 33/08 (2013.01); B29K 2033/08 (2013.01); B29K 2063/00 (2013.01)]

27 Claims

1. A resin system comprising:

a. a resin including:

i. 1-30 wt % of a binder comprising an organic photopolymerizable monomer, oligomer, or polymer, wherein the organic photopolymerizable monomer, oligomer, or polymer is a liquid at a temperature from −25° C. to 90° C.;

ii. >0-10 wt % of a photoinitiator; and

b. 50-90 wt % of a filler including:

i. glass or glass ceramic particles wherein the particles have an average size along their longest dimension of from 5 nm to 20 nm;

c. wherein the resin system meets one or more of the following:

the viscosity of the resin system is from 2000 cP to 75,000 cP;

the yield stress of the resin system is from 1 to 10 Pa;

the resin system shows less than a 20% change in viscosity or yield stress over a period of 30 days in a hermetically sealed container at 1 atm and 25° C.; or

the resin system scores a value of from 4 to 10 on the ASTM D869 settling test over a period of 48 hours.