US 11,911,904 B2
Apparatus and methods for enhanced microelectronic device handling
Kuan Wei Tseng, Taichung (TW); and Brandon P. Wirz, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jul. 15, 2020, as Appl. No. 16/930,144.
Prior Publication US 2022/0016768 A1, Jan. 20, 2022
Int. Cl. B25J 9/16 (2006.01); B25J 19/02 (2006.01); H05K 13/08 (2006.01); B25J 13/08 (2006.01); H01L 23/00 (2006.01); H01L 21/67 (2006.01)
CPC B25J 9/1633 (2013.01) [B25J 13/085 (2013.01); B25J 19/028 (2013.01); H01L 21/67144 (2013.01); H01L 24/75 (2013.01); H05K 13/082 (2018.08); H01L 2224/7565 (2013.01); H01L 2224/7592 (2013.01)] 31 Claims
OG exemplary drawing
 
1. Apparatus for handling microelectronic devices, comprising:
a pick arm having a pick surface configured for receiving a microelectronic device thereon;
drives for moving the pick arm and reorienting the pick surface in X, Y and Z planes and about a horizontal rotational axis and a vertical rotational axis;
a sensor device carried by the pick arm and configured to detect at least one of at least one magnitude of force or at least one location of force applied between the pick surface and a structure contacted by the pick surface or a structure and a microelectronic device carried on the pick surface; and
a controller programmed to control the drives for moving the pick arm and reorienting of the pick surface, the controller configured to reorient the microelectronic device carried on the pick surface responsive to the sensor device detecting the at least one of at least one magnitude of force or at least one location of force applied between the structure and the microelectronic device.