US 11,911,868 B2
Substrate processing apparatus, substrate processing method, and storage medium that stores program to cause computer in substrate processing apparatus to execute substrate processing method
Takashi Mitsuya, Tokyo (JP); Asagi Matsugu, Tokyo (JP); and Ayumu Saito, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Jun. 23, 2021, as Appl. No. 17/355,525.
Claims priority of application No. 2020-111535 (JP), filed on Jun. 29, 2020.
Prior Publication US 2021/0402548 A1, Dec. 30, 2021
Int. Cl. B24B 37/005 (2012.01); H01L 21/66 (2006.01); H01L 21/306 (2006.01)
CPC B24B 37/005 (2013.01) [H01L 21/30625 (2013.01); H01L 22/26 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a polishing table to which a polishing pad for polishing a substrate is attachable;
a polishing head for holding and pressing the substrate against the polishing pad;
a retainer member disposed surrounding the polishing head;
a retainer member pressurization chamber disposed adjacent to the retainer member;
an arm for holding and turning the polishing head;
a slip out detector for detecting a slipout of the substrate from the polishing head based on a turning torque of the arm, and
a speed detector for detecting a turning speed of the arm,
wherein the slip out detector is configured to stop the detection of the slipout of the substrate from the polishing head based on the speed detected by the speed detector.