US D1,063,595 S
CMP (chemical mechanical planarization) retaining ring
Hyungjoo Lee, Suwon-si (KR); and Hyeondong Song, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jun. 15, 2023, as Appl. No. 29/894,971.
Claims priority of application No. 30-2023-0012062 (KR), filed on Mar. 30, 2023.
Term of patent 15 Years
LOC (15) Cl. 13 - 03
U.S. Cl. D13—182
OG exemplary drawing
 
The ornamental design for a CMP (chemical mechanical planarization) retaining ring as shown and described.