US 12,239,025 B2
Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, and electronic apparatus
Koji Ohashi, Matsumoto (JP); Chikara Kojima, Matsumoto (JP); Hiroshi Matsuda, Chino (JP); Hironori Suzuki, Chino (JP); and Shuichi Tanaka, Chino (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Jan. 3, 2024, as Appl. No. 18/402,907.
Application 18/402,907 is a continuation of application No. 18/151,640, filed on Jan. 9, 2023, granted, now 11,917,922.
Application 18/151,640 is a continuation of application No. 16/097,011, granted, now 11,581,478, issued on Feb. 14, 2023, previously published as PCT/JP2017/015920, filed on Apr. 20, 2017.
Claims priority of application No. 2016-089569 (JP), filed on Apr. 27, 2016; and application No. 2016-184369 (JP), filed on Sep. 21, 2016.
Prior Publication US 2024/0147866 A1, May 2, 2024
Int. Cl. H01L 41/053 (2006.01); B06B 1/06 (2006.01); H10N 30/87 (2023.01); H10N 30/88 (2023.01); A61B 8/00 (2006.01); H10N 39/00 (2023.01)
CPC H10N 30/88 (2023.02) [B06B 1/0622 (2013.01); B06B 1/0629 (2013.01); H10N 30/87 (2023.02); H10N 30/875 (2023.02); A61B 8/4444 (2013.01); A61B 8/4477 (2013.01); A61B 8/4494 (2013.01); H10N 39/00 (2023.02)] 4 Claims
OG exemplary drawing
 
1. A mounting structure comprising:
a first substrate having a first surface;
a second substrate having a second surface facing the first surface of the first substrate and a third surface opposite to the second surface;
a functional element disposed between the first substrate and the second substrate;
a conduction portion disposed on the second surface of the second substrate and electrically connected to the functional element;
a first electrode wire disposed on the third surface of the second substrate; and
a first through electrode electrically connecting the conduction portion and the first electrode wire,
wherein the first surface of the first substrate has a protrusion portion that protrudes toward the second substrate at a position facing the conduction portion.