US 12,239,020 B2
Thermoelectric conversion module
Toshiya Yamasaki, Saitama (JP); Kunihisa Kato, Warabi (JP); and Yuta Seki, Kawasaki (JP)
Assigned to LINTEC CORPORATION, Tokyo (JP)
Appl. No. 17/913,487
Filed by LINTEC CORPORATION, Tokyo (JP)
PCT Filed Mar. 18, 2021, PCT No. PCT/JP2021/011109
§ 371(c)(1), (2) Date Sep. 22, 2022,
PCT Pub. No. WO2021/193357, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 2020-054840 (JP), filed on Mar. 25, 2020.
Prior Publication US 2023/0133754 A1, May 4, 2023
Int. Cl. H10N 10/852 (2023.01); H10N 10/855 (2023.01); H10N 10/857 (2023.01)
CPC H10N 10/852 (2023.02) [H10N 10/855 (2023.02); H10N 10/857 (2023.02)] 15 Claims
OG exemplary drawing
 
1. A thermoelectric conversion module comprising a thermoelectric conversion material layer, the thermoelectric conversion material layer comprising a thermoelectric conversion material containing a fired body of a coating film of a thermoelectric semiconductor composition comprising thermoelectric semiconductor particles, a polycarbonate binder resin, and at least one of an ionic liquid and an inorganic compound,
wherein the thermoelectric conversion material layer has voids, and
a proportion of an area occupied by the thermoelectric conversion material within an area of a longitudinal cross-section that includes a center portion of the thermoelectric conversion material layer, defined as a filling ratio, is greater than 0.900 and less than 1.000.