US 12,239,003 B2
Display panel and manufacturing method thereof
Gaobo Lin, Guangdong (CN)
Assigned to SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Guangdong (CN)
Appl. No. 17/618,469
Filed by SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Guangdong (CN)
PCT Filed Nov. 23, 2021, PCT No. PCT/CN2021/132541
§ 371(c)(1), (2) Date Dec. 11, 2021,
PCT Pub. No. WO2023/087335, PCT Pub. Date May 25, 2023.
Claims priority of application No. 202111357202.8 (CN), filed on Nov. 16, 2021.
Prior Publication US 2024/0016030 A1, Jan. 11, 2024
Int. Cl. H10K 59/80 (2023.01); H10K 59/12 (2023.01); H10K 59/122 (2023.01); H10K 59/124 (2023.01); H10K 59/131 (2023.01)
CPC H10K 59/80518 (2023.02) [H10K 59/1201 (2023.02); H10K 59/122 (2023.02); H10K 59/124 (2023.02); H10K 59/131 (2023.02); H10K 59/873 (2023.02); H10K 59/8792 (2023.02)] 6 Claims
OG exemplary drawing
 
1. A display panel, comprising:
a substrate;
a driving circuit layer, wherein the driving circuit layer is disposed on the substrate, the driving circuit layer comprises an auxiliary electrode and an undercut structure disposed on the auxiliary electrode, an undercut space is defined on the undercut structure, the auxiliary electrode comprises a connection portion, the connection portion extends along a peripheral direction of the undercut structure, and the connection portion is exposed by the undercut space;
a first electrode, wherein the first electrode is disposed on the driving circuit layer, the first electrode is a reflective electrode;
a light-emitting layer and a second electrode, wherein the light-emitting layer is disposed on the first electrode, the second electrode is disposed on the light-emitting layer, the light-emitting layer and the second electrode are cut at where the undercut structure is, and the second electrode is connected to the connection portion of the auxiliary electrode; and
an encapsulation layer, wherein the encapsulation layer covers the second electrode, and the encapsulation layer extends into the undercut space and covers the second electrode;
wherein the undercut structure comprises a support portion and a block portion, the auxiliary electrode comprises a carrier portion, the connection portion is connected on a peripheral side of the carrier portion, the support portion is disposed on the carrier portion, the block portion comprises a connection part and a hanged part connected to the connection part, the connection part is disposed on the support portion, the hanged part protrudes out from the support portion, and lateral surfaces of the hanged part and the support portion form the undercut space;
a first opening is defined in the driving circuit layer, and the undercut structure is disposed in the first opening, a thickness of the second electrode gradually increases in a direction from the support portion toward a hole wall of the first opening in the undercut space; and
the driving circuit layer comprises a passivation layer disposed on the substrate and a planarization layer disposed on the passivation layer, the auxiliary electrode comprises a peripheral portion, the peripheral portion is connected on a peripheral side of the connection portion, the passivation layer covers the peripheral portion, the first opening comprises a first branch hole and a second branch hole communicated with each other, the first branch hole is defined in the passivation layer, the second branch hole is defined in the planarization layer, a hole wall of the second branch hole is located at a periphery of a hole wall of the first branch hole; a width of the connection portion is greater than or equal to 4 μm, and a distance from the block portion to the hole wall of the second branch hole is greater than or equal to 6 μm.