US 12,238,961 B2
Light-emitting devices with improved light outcoupling
Florian Pschenitzka, San Francisco, CA (US); and Christopher D. Favaro, Sunnyvale, CA (US)
Assigned to Kateeva, Inc., Newark, CA (US)
Filed by Kateeva, Inc., Newark, CA (US)
Filed on Sep. 8, 2023, as Appl. No. 18/464,130.
Application 18/464,130 is a continuation of application No. 17/302,759, filed on May 11, 2021, granted, now 11,793,024.
Application 17/302,759 is a continuation of application No. 16/771,157, granted, now 11,043,653, issued on Jun. 22, 2021, previously published as PCT/US2018/063492, filed on Nov. 30, 2018.
Claims priority of provisional application 62/607,824, filed on Dec. 19, 2017.
Prior Publication US 2023/0422545 A1, Dec. 28, 2023
Int. Cl. H01L 29/08 (2006.01); H10K 50/844 (2023.01); H10K 50/858 (2023.01); H10K 102/00 (2023.01)
CPC H10K 50/844 (2023.02) [H10K 50/858 (2023.02); H10K 2102/00 (2023.02)] 19 Claims
OG exemplary drawing
 
1. An encapsulation stack for an optoelectronic device, the encapsulation stack comprising a composite film having a first domain and a second domain, the second domain comprising a plurality of sub-domains, wherein the second domain comprises silicon oxide particles, silicon nitride particles, silicon oxynitride particles, or a combination thereof dispersed in an acrylic matrix and has a higher index of refraction than the first domain, and at least some of the particles are surface-functionalized.