US 12,238,958 B2
Organic electroluminescence module, encapsulating method thereof, and display device
Wendong Lian, Guangdong (CN)
Assigned to Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Guangdong (CN)
Appl. No. 17/622,818
Filed by SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Guangdong (CN)
PCT Filed Dec. 20, 2021, PCT No. PCT/CN2021/139814
§ 371(c)(1), (2) Date Dec. 25, 2021,
PCT Pub. No. WO2023/108696, PCT Pub. Date Jun. 22, 2023.
Claims priority of application No. 202111540929.X (CN), filed on Dec. 16, 2021.
Prior Publication US 2024/0032324 A1, Jan. 25, 2024
Int. Cl. H10K 59/00 (2023.01); H10K 50/844 (2023.01)
CPC H10K 50/844 (2023.02) 15 Claims
OG exemplary drawing
 
1. An organic electroluminescence module, comprising:
a substrate;
an organic electroluminescent device disposed on the substrate;
a first encapsulation layer disposed on a side of the organic electroluminescent device away from the substrate; and
a second encapsulation layer disposed on a side of the first encapsulation layer away from the substrate;
wherein the first encapsulation layer is configured to prevent a gas generated by the second encapsulation layer from entering the organic electroluminescent device, and the second encapsulation layer is configured to prevent moisture or oxygen from entering the organic electroluminescent device;
the organic electroluminescence module further comprises:
a circuit layer and a cover plate, wherein the circuit layer is disposed on the substrate and connected to the luminescent device, and the cover plate is disposed on the side of the first encapsulation layer away from the substrate;
wherein the second encapsulation layer comprises an encapsulation adhesive, a water-absorbing adhesive, and a filling adhesive, the encapsulation adhesive is connected to the circuit layer and the cover plate, the water-absorbing adhesive is connected to the circuit layer, the cover plate, and the filling adhesive, and the filling adhesive is connected to the water-absorbing adhesive and is disposed between the luminescent device and the cover plate.