US 12,238,941 B2
Semiconductor device having gate isolation layer
Seung Seok Ha, Suwon-si (KR); Hyun Seung Song, Suwon-si (KR); Hyo Jin Kim, Suwon-si (KR); Kyoung Mi Park, Suwon-si (KR); and Guk Il An, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Feb. 8, 2024, as Appl. No. 18/436,812.
Application 18/436,812 is a continuation of application No. 17/977,031, filed on Oct. 31, 2022, granted, now 11,929,367.
Application 17/977,031 is a continuation of application No. 17/036,355, filed on Sep. 29, 2020, granted, now 11,488,953.
Application 17/036,355 is a continuation of application No. 16/290,199, filed on Mar. 1, 2019, granted, now 10,825,809.
Claims priority of application No. 10-2018-0092505 (KR), filed on Aug. 8, 2018.
Prior Publication US 2024/0186321 A1, Jun. 6, 2024
Int. Cl. H10D 84/83 (2025.01); H01L 21/308 (2006.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01); H10D 64/01 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01)
CPC H10D 84/834 (2025.01) [H01L 21/3086 (2013.01); H10D 30/024 (2025.01); H10D 30/6211 (2025.01); H10D 64/017 (2025.01); H10D 64/018 (2025.01); H10D 64/021 (2025.01); H10D 84/0135 (2025.01); H10D 84/0147 (2025.01); H10D 84/0151 (2025.01); H10D 84/0158 (2025.01); H10D 84/038 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate having a first region and a second region;
first active fins that extend in a first direction in the first region;
second active fins that extend in the first direction in the second region;
a first field insulating layer between the first active fins and extending in a second direction;
a second field insulating layer between the second active fins and extending in the second direction;
a gate line that extends in the second direction on the second field insulating layer; and
a gate isolation layer in contact with a side surface of the first field insulating layer in the second direction,
wherein an upper surface of the first field insulating layer is at a first level and an upper surface of the second field insulating layer is at a second level that is lower than the first level, and
wherein a bottom surface of the first field insulating layer is at a third level and a bottom surface of the second field insulating layer is at a fourth level that is different from the third level.