US 12,238,918 B1
Semiconductor device, manufacturing method therefor, and electronic device
Wenhua Gui, Beijing (CN); Xuezheng Ai, Beijing (CN); Guilei Wang, Beijing (CN); Jin Dai, Beijing (CN); and Xiangsheng Wang, Beijing (CN)
Assigned to BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY, Beijing (CN)
Filed by BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY, Beijing (CN)
Filed on Jun. 26, 2024, as Appl. No. 18/754,418.
Application 18/754,418 is a continuation of application No. PCT/CN2024/076732, filed on Feb. 7, 2024.
Claims priority of application No. 202311000832.9 (CN), filed on Aug. 10, 2023.
Int. Cl. H10B 12/00 (2023.01)
CPC H10B 12/30 (2023.02) [H10B 12/03 (2023.02); H10B 12/05 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising: a plurality of storage cells stacked in a direction perpendicular to a base substrate, wherein the plurality of storage cells comprise:
a plurality of transistors, distributed in different layers and stacked along the direction perpendicular to the base substrate;
a word line, penetrating the different layers and extending in the direction perpendicular to the base substrate;
a plurality of capacitors, connected with the plurality of transistors in a one-to-one correspondence; wherein a capacitor comprises a first electrode and a second electrode; a transistor comprises a first source/drain electrode, a second source/drain electrode, and a semiconductor layer surrounding a sidewall of the word line; the first source/drain electrode is connected with a first electrode of a corresponding capacitor;
first insulating layers and conductive layers, alternately distributed in the direction perpendicular to the base substrate, wherein each of the conductive layers comprises the first source/drain electrode, the second source/drain electrode and the first electrode;
wherein a region of the first electrode comprises at least one first hole penetrating each of the first insulating layers and each of the conductive layers, and further comprises a second hole penetrating the first insulating layers and the conductive layers; the word line is disposed in the second hole; an orthographic projection of a second sub-hole, located on the conductive layer, of the second hole on the base substrate falls into an orthographic projection of a first sub-hole, located on the first insulating layer, of the second hole on the base substrate; the second electrode comprises an inner electrode disposed in the first hole and insulated from each first electrode;
the semiconductor layer comprises a first groove of which opening is towards the first source/drain electrode, the first source/drain electrode fills the first groove.