US 12,238,906 B2
Power electronic device assemblies having heat spreaders and electrically insulating layer
Feng Zhou, Ann Arbor, MI (US); and Tianzhu Fan, Houston, TX (US)
Assigned to TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., Plano, TX (US)
Filed by Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US)
Filed on Jan. 17, 2023, as Appl. No. 18/155,464.
Prior Publication US 2024/0244805 A1, Jul. 18, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/20927 (2013.01) [H05K 1/0204 (2013.01); H05K 1/185 (2013.01); H05K 7/20254 (2013.01); H05K 7/20272 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A power electronics device assembly comprising:
an S-cell comprising:
a first metal layer comprising a first surface having a recess;
a graphite layer bonded to the first metal layer;
a second metal layer bonded to the graphite layer;
a solder layer disposed on the second metal layer; and
an electrically insulating layer bonded to the solder layer; and
a power electronics device disposed within the recess of the first surface of the first metal layer.